a) CAD view of a sensor module that comprises a sensor stack and two front sensors on their respective PCB that also holds the corresponding charge sensitive amplifier (CSA). b) Cross-section view through a sensor stack showing from right to left, the four sensor layers where each holds a silicon sensor (S2, D1, D2, or D3) and its adjacent CSA circuit, the tungsten plate W (violet), and the two layers that comprise the driver circuit and the ADC circuit.